Alphabetical Index
Browse by Elements
Keyword Search
ASTM Electrolytes
Macro Etchants
Micro Etchants
Named Etchants
New Etchants
Al and Al Alloys
Cu and Cu Alloys
Fe and Fe Alloys
Ni and Ni Alloys
Carbide Etchants
Fluoride Etchants
Nitride Etchants
Other Etchants
Oxide Etchants
Phosphide Etchants
Single Crystal Etchants
Thin Film Etchants
Wafer Etchants
Help
Home
Etchants for Tungsten and Alloys
ASTM etchant No. 131 - Tungsten - Electrolytic etching
ASTM etchant No. 131 - Tungsten - Electrolytic etching
ASTM etchant No. 132a - As cast tungsten - Chemical etching
ASTM etchant No. 209 - Tungsten - Chemical etching
ASTM etchant No. 209 - W-Th
ASTM etchant No. 98c - Pure tungsten - Chemical etching
Agua Regia - W specimens - Chemical etching
Alkaline sodium picrate etchant - W-Co eutectic alloys - Chemical etching
Alloys of WC and Co - Electrolytic etching
BRM etchant - WS2 single crystal specimens - Chemical polishing
BRM etchant - WSe2 single crystal specimens - Chemical polishing
Cemented carbides - Can be used for all compositions - Chemical etching
Ceramics, carbides - WC
Cermets, sintered carbides - Attack polishing
Coated cutting insert - Chemical etching
Hard metals - Chemical etching
Hardmetals - Electrolytic polishing
Mixed sintered carbides - Electrolytic etching
Murakami's etchant - W and W alloys - Chemical etching
Murakami's etchant - Tungsten - Electric contact material
Murakami's etchant - Tungsten - Mo, W and their alloys
Murakami's etchant - Tungsten-Copper (W-Cu) - Electric contact material
Murakami's etchant - Tungsten-Nickel (W-Ni) - Electric contact material
Murakami's etchant - Tungsten-rhenium-thoria system (O-Re-Th-W)-W - 3% Re-2% ThO2
Murakami's etchant - W-Hf alloys (< 3% Hf) - Chemical etching
Murakami's etchant - W-Hf-N alloys alloy - < 3% Hf, nitrided
Murakami's etchant - W-Hf-Re alloys - Chemical etching
Murakami's etchant - W-Hf-Re-N alloys alloy - < 2% Hf, < 25% Re, nitrided
Murakami's etchant - W-Mo-Hf-Re alloy - < 20% Mo, < 2% Hf, < 30% Re
Murakami's etchant - W-Mo-Hf-Re-N alloy - < 20% Mo, < 2% Hf, < 30% Re, nitrided
Murakami's etchant - WC specimens - Chemical cleaning
Murakami's etchant - WC-Co, Eta phase appears multicolored; Co is white, WC-TiC-TaC-Co, WC-NbC-Co
Murakami's etchant, modified - Tungsten - Mo, W and their alloys
Murakami's etchant, modified - W and lean alloys - Chemical etching
Pure W (tungsten) - Chemical etching
Refractory metals (W, V, Nb, Ta) - Chemical etching - General macrostructure
Si3N4 ceramic with TiN - Plasma etching
Sintered carbides - Chemical etching
Sintered carbides - Electrolytic polishing
Sintered carbides - General etching of sintered carbides
Sintered carbides - Particularly for sintered carbides which-apart from WC-also contain TiC, TaC and NbC
Sintered carbides - Sintered carbides containing Ni-phase
Sintered carbides - Sintered carbides with high content of Ti and Ta carbides
Sintered carbides - To reveal boundaries of the carbide grains against the cobalt phase
Steel specimens and cast irons - Chemical etching - General macrostructure
Tint etch for W - Pre-etch with grain boundary etch
Tungsten boride - Attack polishing
Tungsten - Attack polishing
Tungsten - Attack polishing
Tungsten - Attack polishing
Tungsten - Cathodic etching
Tungsten - Chemical etching
Tungsten - Chemical etching
Tungsten - Chemical etching
Tungsten - Chemo-mechanical polishing
Tungsten - Cr, Mo, Mo-Cr alloys (up to 80% Cr)
Tungsten - Dislocation etching
Tungsten - Dislocation etching
Tungsten - Electrolytic polishing
Tungsten - Electrolytic polishing
Tungsten - Electrolytic polishing
Tungsten - Electrolytic polishing
Tungsten - Electrolytic polishing
Tungsten - Electrolytic polishing
Tungsten - Electrolytic polishing
Tungsten - Electrolytic polishing
Tungsten - Electrolytic polishing
Tungsten - Electrolytic polishing and etching
Tungsten - Electrolytic thinning
Tungsten - Electrolytic thinning
Tungsten - Electrolytic thinning by window technique
Tungsten - Electromechanical polishing
Tungsten - Eutectic W-Co alloys
Tungsten - For removing slip lines and twins
Tungsten - For sub grain boundaries and slip lines
Tungsten - Mo and Mo-Ni alloys, W and W alloys
Tungsten - Mo, W and their alloys
Tungsten - Mo, W and their alloys
Tungsten - Mo, W and their alloys
Tungsten - Tint etching
Tungsten - W and W base alloys
Tungsten - W and W base alloys
Tungsten - W and W base alloys. Mo and Mo base alloys
Tungsten - W and W base alloys. Ta na Ta base alloys
Tungsten - W-Co alloys containing 10-70% W
Tungsten alloys - Electrolytic polishing
Tungsten alloys - Electrolytic polishing
Tungsten and tungsten alloys - Chemical etching
Tungsten and tungsten alloys - Chemical etching
Tungsten and tungsten alloys - Chemical etching
Tungsten and tungsten alloys - W-Co alloys with 10-70% W
Tungsten and tungsten alloys - W-Co alloys with 10-70% W
Tungsten and tungsten alloys - W-Co alloys with eutectic compostion (cca 46% W)
Tungsten samples - Mo, W and V
Tungsten samples - Mo, W, V, Nb, Ta and their alloys
Tungsten single crystal - Electrolytic polishing
Tungsten single crystal - Electrolytic polishing, chemical polishing
Tungsten specimens - Chemical etching
Tungsten specimens - Chemical etching
Tungsten specimens - Chemical etching
Tungsten, color etchant - Chemical etching
Tungsten-2.8 vol.% ThO2 alloy - Electrolytic thinning
Tungsten-Silicon alloys (WSi2) - Chemical etching
Tungsten-Wire - Electrolytic polishing
W (001) wafers - Chemical etching
W (001) wafers and other orientations - Acid thinning
W (001) wafers and single crystals - Electrolytic polishing
W (111) wafers as deposited thin film - Ionized gas etching
W - Chemical-Mechanical polishing
W - Electrolytic lapping
W and W alloys - Electrolytic polishing - Dislocation etching
W and W alloys - Electrolytic polishing - Dislocation etching
W and W alloys - Electrolytic polishing - Dislocation etching
W and W alloys - Electrolytic polishing - Dislocation etching
W and alloys - Chemical etching
W and alloys - Chemical etching
W and alloys - Chemical etching
W and alloys - Chemical etching
W and alloys - Electrolytic etching
W and alloys - Electrolytic etching
W and alloys - Electrolytic etching
W discs of pressed powder - Chemical cleaning
W single crystal wafers - Chemical etching
W specimens - Alcohol cleaning
W specimens - Chemical cleaning
W specimens - Chemical cleaning
W specimens - Chemical etching
W specimens - Chemical etching
W specimens - Chemical etching
W specimens - Chemical etching
W specimens - Chemical etching
W specimens - Chemical etching
W specimens - Chemical polishing
W specimens - Chmical cleaning or electrolytic polishing
W specimens - Electrolytic polishing
W specimens - Keytone cleaning
W specimens and W thin film deposits - Chemical etching
W specimens and parts - Chemical cleaning
W specimens as wire, W single crystal wafers - Gas, forming
W specimens used for electroplating - Chemical polishing
W specimens used for electroplating - Chemical polishing
W specimens used for electroplating - Chemical polishing
W specimens used for electroplating - Chemical polishing
W specimens used for electroplating - Chemical polishing
W thin film evaporated on silicon (100) substrates - Ionized gas etching
W thin film evaporation in vacuum systems - Chemical etching
W thin films - Chemical etching
W thin films - Chemical etching
W thin films - Chemical etching
W thin films - Ionized gas etching
W thin films deposited by sputtering - Ionized gas entrapment
W wire 0.015-0.025 diameter - Chemical cleaning
W wires and whiskers - Electrolytic polishing
W, V, Cb, and Ta alloys - Chemical etching - General macrostructure
W, V, Nb, Ta - General macrostructure
W-10% Co specimen - For electron and optical microscopy
W-3% Re alloy - Chemical etching
W-C system - Chemical etching
W-Co alloys - Chemical etching
W-Co alloys ith 10-70% W - Chemical etching
W-Hf alloys - Chemical etching
W-Mo-Os alloys - Chemical etching
W-Ni-Fe alloys - Electrolytic polishing
W-Re alloy (23.4% Re + 0.3% HfC) - Electrolytic thinning
W-Re alloy (25% Re) - Electrolytic polishing and chemical etching
W-Re alloy (3% Re) - Chemical etching
W-Re alloys (5, 25% Re) - Electrolytic polishing
W-Re alloys (9, 24% Re) - Electrolytic thinning
W-Re-Hf-C alloy - 4 at.% Re, 0.2-0.8 at.% Hf, up to 1.35 at.% C
W-Sc alloys - Chemical etching
W-Ta alloy (3% Ta) - Electrolytic thinning
W-Th alloys - Chemical etching
W-Th alloys - Chemical etching
W-Ti-B alloys - Chemical etching
W-Y alloys - Chemical etching
W2O3(PO4)2 as an amorphous glassy thin film - Chemical etching
WB2 and other tungsten borides - Chemical etching
WB2 and other tungsten borides - Chemical etching
WB2, W2B2, W2B5 - Chemical etching
WC - Chemical etching
WC - Chemical etching
WC - Chemical etching
WC single crystal specimens - Thermal etching
WC, Mo2C, TiC, or Ni in sintered carbides - Chemical etching
WC, TiC, TaC, and Co in sintered carbides - Chemical etching
WC-6% Co alloy - For revealing the microstructure of the WC-Co material
WC-Co - Chemical etching
WC-Co - Chemical etching
WC-Co - Chemical etching
WC-Co - Good etchant for WC crystals - Electrolytic etching
WC-Co - Suited for SEM examination - Electrolytic etching
WC-Co and complex sintered carbides - Chemical etching
WC-Co or Ni matrix with Mo2C, TiC, WC2, TaC - Chemical etching
WC-Co sintered carbides - Chemical etching
WC-Co system - Electrolytic thinning
WC-Co, WC-TiC-TaC-Co - Chemical etching
WC-Co, reveals Co - Electrolytic etching
WC-Mo2C-TiC-Ni - Chemical etching
WC-Mo2C-TiC-Ni cemented carbides
WC-Ti-Ta, NbC-Co - Physical etching
WC-TiC-NbC-Co - Chemical etching
WO(x) (x=3) thin film
WO2 oxide specimens - Chemical etching
WO3 oxide specimens - Chemical etching
WO3 thin film deposited on 2100 A SnO2 on a glass substrate - Chemical etching
WRh (2%) and (6%), (100) wafers - Electrolytic polishing
WSe2 single crystal specimens - Solvent cleaning
WSi2 thin films
WSi2 thin films - Chemical etching
WSi2 thin films grown on silicon substrates - Ionized gas etching
a-WO3 thin films 499-8500 A thick - Chemical etching