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Quartz - Dry Etching

Material Name: Quartz
Recipe No.: 10325
Primary Chemical Element in Material: Si
Sample Type: Layer
Uses: Etching
Etchant Name: None
Etching Method: Dry etching
Etchant (Electrolyte) Composition: CF4=15 sccm, He=40 sccm, RF=130 W, Pressure=40 mTorr. Etch rate 31 nm/min.
Procedure (Condition): No data
Note: Trion etcher
Reference: Ricardo Garcia, Marylène Palard, DRY ETCHING CAPABILITIES, Texas Nanofabrication Facility (TNF) node of the National Nanotechnology Coordinated Infrastructure, UTexas at Austin, 2016, PowerPoint Presentation, pp. 1-18.