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Sb (0001) Wafers - Wet Etching

Material Name: Sb (0001) wafers
Recipe No.: 30
Primary Chemical Element in Material: Sb
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: Wet etching
Etchant (Electrolyte) Composition: 2 parts HF, 3 parts HNO3, 5 parts H2O.
Procedure (Condition): No data
Note: Sb (0001) wafers. Cut wafers under glycol thallate with a high speed cutting wheel to prevent chipping. Mechanically lap with 600 grit, then 000 and 0000 aluminum abrasive paper. Use solution shown as a light etch to remove damage and debris. specimens used in a study of self-diffusion.
Reference: Rosolowski, J H et al. - J Appl Phys, 31,3027(1964).