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Sb (0001) Wafers Cleaved under LN2 - Chemical Polishing

Material Name: Sb (0001) wafers cleaved under LN2
Recipe No.: 33
Primary Chemical Element in Material: Sb
Sample Type: Wafer
Uses: Polishing
Etchant Name: None
Etching Method: Chemical polishing
Etchant (Electrolyte) Composition: 2 parts HF, 5 parts HNO3, 4 parts HAc, 1 part Br2.
Procedure (Condition): Time: 1-2 sec, temperature: RT.
Note: Sb (OOO1) wafers cleaved under LN2. Solution produces an uneven polish with both pits and gas evolution.
Reference: Fred Hargreaves (Ret.), Personal Etchants Database 1960-1990, Analytical Services Bookham Technology, Caswell, Towcester, Northamptonshire NN8EQ, UK.