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InGaAs from InAlAs - Dry Etching

Material Name: InGaAs from InAlAs
Recipe No.: 4554
Primary Chemical Element in Material: In
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: Dry etching
Etchant (Electrolyte) Composition: Reactive ion etch; SiCl4/SiF4
Procedure (Condition): No data
Note: Dry etch - material selective. Reactive ion etch; SiCl4/SiF4; addition of O2 increases selectivity of etching GaAs from AlGaAs; Ref. (Murad, S.K., 1996a).
Reference: A.R. Clawson, Guide to references on III-V semiconductor chemical etching, Materials Science and Engineering (Original Reference List), 31 (2001), p. 127.