Dielectric Etching - RIE - Dry Etching

Material Name: No data
Recipe No.: 8500
Primary Chemical Element in Material: No data
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: Dry etching
Etchant (Electrolyte) Composition: See the Figure 1.
Procedure (Condition): No data
Note: No data
Reference: PG64936, Chapter 3 Chemical Nano-Processing, 3-4. Etching, Pusan National University Library, South Korea, 2020, pp. 1-59.


Figure 1: Dielectric etching – RIE.

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