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Delamination, Adhesive Squeeze Out, Blisters, Crack at Edge Zone, Crack, Wafer Shift

Material Name: Silicon
Record No.: 101
Primary Chemical Element in Material: Si
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: Dry etching
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: Failures & Problems Related with ZoneBOND De-Bonding.
Reference: Choon Lee, Hot Chips: Stacking Tutorial, Amkor Technology, 2012 IEEE Hot Chips 24 Symposium (HCS), PowerPoint Presentation, pp. 1-52.


Figure 1: Delamination, Adhesive squeeze out, Blisters, Crack at edge zone, Crack, Wafer shift.