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Si Recess Etching: Dry Etch

Material Name: Silicon
Record No.: 102
Primary Chemical Element in Material: Si
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: Dry etching
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: No data
Reference: Choon Lee, Hot Chips: Stacking Tutorial, Amkor Technology, 2012 IEEE Hot Chips 24 Symposium (HCS), PowerPoint Presentation, pp. 1-52.


Figure 1: Si recess etching: Dry etch.