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Cooper Voids, Silicon Micrograss

Material Name: Silicon
Record No.: 104
Primary Chemical Element in Material: Si
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: Dry etching
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: No data
Reference: Isabella Para, Thermal dissipation improvement by new technology approach: study, development and characterization, PHD Thesis, POLITECNICO DI TORINO, 2017, p. 91.


Figure 1: Defects summary.