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Defect Etching in Silicon

Material Name: Silicon
Record No.: 11
Primary Chemical Element in Material: Si
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: Dry etching
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: Please see the file.
Reference: H. Föll (Defects - Script), Defect Etching in Silicon, https://www.tf.uni-kiel.de/matwis/amat/def_en/kap_6/advanced/t6_1_2.html, 2020, pp. 1-3.