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TMDE - Time Multiplexed Deep Etching

Material Name: Silicon
Record No.: 126
Primary Chemical Element in Material: Si
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: Dry etching
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: No data
Reference: Sumita Pennathur, ME 141B: The MEMS Class Introduction to MEMS and MEMS Design, UCSB NanoLab, PowerPoint Presentation, 2010, pp. 1-90.


Figure 1: TMDE.