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Faceting/Trenching/Sidewall Taper

Material Name: Silicon
Record No.: 137
Primary Chemical Element in Material: Si
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: Dry etching
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: See the Fig. 1.
Reference: John D. Williams, Fall 2008 EE 410/510:Microfabrication and Semiconductor ProcessesM W 12:45 PM –2:20 PMEB 239 Engineering Bldg., University of Alabama in Huntsville, PowerPoint Presentation, 1999, pp. 1-91.


Figure 1: Faceting/trenching/sidewall taper.