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Contaminants Over the Substrate Surface

Material Name: Silicon
Record No.: 152
Primary Chemical Element in Material: Si
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: No data
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: No data
Reference: Owen Cherry, Fabrication of an Atom Chip for Rydberg Atom-Metal SurfaceInteraction Studies, MSc Thesis, University of Waterloo, Ontario, 2007, p. 105.


Figure 1: Microscope image of patterned lift-off photoresist (Futurrex NR1-3000PY). Dirty chemicals and improper rinsing and drying lead to contaminants over the substrate surface. This will hinder the adhesion of subsequent layers.