Residue Clinging to Wire Edges

Residue Clinging to Wire Edges

Material Name: Silicon
Record No.: 155
Primary Chemical Element in Material: Si
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: No data
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: No data
Reference: Owen Cherry, Fabrication of an Atom Chip for Rydberg Atom-Metal SurfaceInteraction Studies, MSc Thesis, University of Waterloo, Ontario, 2007, p. 107.

Figure 1: Microscope image of residue clinging to wire edges. Photoresist residue or thin metal films that may have coated the resist sidewalls must be removed using low power ultrasonic cleaning.