Uniform Etching of PI 2562

Uniform Etching of PI 2562

Material Name: Silicon
Record No.: 157
Primary Chemical Element in Material: Si
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: Wet etching
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: No data
Reference: Owen Cherry, Fabrication of an Atom Chip for Rydberg Atom-Metal SurfaceInteraction Studies, MSc Thesis, University of Waterloo, Ontario, 2007, p. 108.

Figure 1: SEM image of PI 2562 after etching in KOH (with Al etch mask). Polyimide can be dissoved in KOH, however etching is not uniform. The film softens beneath the etch mask, causing considerable undercut or peeling of large areas. The etched film leaves a residue that is difficult to remove.