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Residue on the Polyimide PI 2611

Material Name: Polyimide PI 2611
Record No.: 158
Primary Chemical Element in Material: Si
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: Dry etching
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: No data
Reference: Owen Cherry, Fabrication of an Atom Chip for Rydberg Atom-Metal SurfaceInteraction Studies, MSc Thesis, University of Waterloo, Ontario, 2007, p. 108.


Figure 1: Photograph of residue left on the plate of the Trion RIE/ICP after etching polyimide PI 2611 with SF6 and O2. This residue was extremelly difficult to remove and did not appear with CF4/O2 and pure O2 recipies.