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Cr/Au film Peeling

Material Name: Polyimide
Record No.: 162
Primary Chemical Element in Material: No data
Sample Type: Layer
Uses: Etching
Etchant Name: None
Etching Method: Dry etching
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: No data
Reference: Owen Cherry, Fabrication of an Atom Chip for Rydberg Atom-Metal SurfaceInteraction Studies, MSc Thesis, University of Waterloo, Ontario, 2007, p. 110.


Figure 1: Microscope image of a Cr/Au film peeling from a polyimide surface after being submitted to an ultrasonic clean. The adhesion between Cr/Au and PI 2562 is sufficient for processing, however ultrasonic cleaning should be avoided.