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Particles on Chips: A Metal Ball

Material Name: No data
Record No.: 17
Primary Chemical Element in Material: No data
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: No data
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: No data
Reference: Website https://www.tf.uni-kiel.de/matwis/amat/elmat_en/kap_5/illustr/kugel.html, 2020.


Figure 1: Here is the large size picture of a metal particle, probably a tiny drop of Al that was burnt of by a an electrical discharge in a sputtering machine and hit the Si as a solidified droplet . It was coated with Al which was subsequently structured by etching. Four conducting lines are now short circuited.