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Misaligned Ball

Material Name: Solder
Record No.: 171
Primary Chemical Element in Material: (Cu)
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: No data
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: Figure 1 is an example of assembly related failure identified by this FA process flow. It was a misaligned ball bond that touched the die edge. The device passed initial testing, but failed after temperature cycle testing. The bond wire section at the ball neck was where the top lapping stopped.
Reference: Zhaofeng Wang, Lars Wagner, Chuan Cheah, Plastic BGA Module FA Process Flow Development, ISTFA 2002, Proceedings of the 28th International Symposium for Testing and Failure Analysis, 3-7 November 2002, Phoenix Civic Center, Phoenix, Arizona, pp. 449-451.


Figure 1: A misaligned ball bond revealed after controlled de-capsulation.