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Fluorine Contamination

Material Name: Wafer
Record No.: 172
Primary Chemical Element in Material: No data
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: Dry etching
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: SEM inspection revealed some "flower-like" defects on the affected bondpads (Fig 1, SEM micrograph). EDX analysis detected high fluorine peak on the "flower-like" defects on the affected bondpads (Fig 2, EDX results).
Reference: Y. N. Hua, et al., A Study on Non-Stick Aluminium Bondpads due to Fluorine Contamination using SEM, EDX, TEM, IC, AUGER, XPS and TOF-SIMS Techniques, ISTFA 2002, Proceedings of the 28th International Symposium for Testing and Failure Analysis, 3-7 November 2002, Phoenix Civic Center, Phoenix, Arizona, pp. 495-504.


Figure 1: SEM micrograph shows the "flower-like " defects with a planar-hexagonal structure.


Figure 2: EDX analysis showing high F peak detected on the affected bondpad.