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Solder-Bump Short

Material Name: Solder
Record No.: 181
Primary Chemical Element in Material: Cu
Sample Type: Wafer
Uses: No data
Etchant Name: None
Etching Method: No data
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: No data
Reference: George F. Gaut, The Use of Precision Selective Area Milling for Failure Analysis of Flip-Chip Packages, ISTFA 2002, Proceedings of the 28th International Symposium for Testing and Failure Analysis, 3-7 November 2002, Phoenix Civic Center, Phoenix, Arizona, pp. 683-687.


Figure 1: SEM photo showing solder-bump short.