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Corrosion of Au Plated Connector

Material Name: Cu
Record No.: 188
Primary Chemical Element in Material: Cu
Sample Type: Bulk
Uses: No data
Etchant Name: None
Etching Method: No data
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: No data
Reference: Sridhar Canumalla and Puligandla Viswanadham, Board Level Failure Mechanisms and Analysis in Hand-held Electronic Products, Richard J. Ross (Editor), Microelectronics Failure Analysis, Desk Reference, Sixth Edition, ASM International, 2011, pp. 23-33.


Figure 1: Corrosion of Au plated connector along with EDX elemental maps of Au, Cu, O, Ni, and Cl.