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Shorted Bumps

Material Name: Solder
Record No.: 190
Primary Chemical Element in Material: No data
Sample Type: Bulk
Uses: No data
Etchant Name: None
Etching Method: No data
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: No data
Reference: Rajen Dias, Failure Analysis Flow for Package Failures; Richard J. Ross (Editor), Microelectronics Failure Analysis, Desk Reference, Sixth Edition, ASM International, 2011, pp. 34-37.


Figure 1: Dark field optical image of x-section of shorted bumps showing that solder extrusion into the underfill void was the mechanism of failure.