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Line Corrosion and Scratches

Material Name: Copper
Record No.: 2
Primary Chemical Element in Material: Cu
Sample Type: Layer
Uses: Polishing
Etchant Name: None
Etching Method: Polishing
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note:
CMP-induced defects.
Defects include metal residues, corrosion, scratches, pinholes, and microcracks.
Reference: Arokia Nathan, Etching and Chemo-Mechanical Polishing, E&CE 493 Topic 2/730 Topic 13 – Nanoelectronics: Winter 2005, PowerPoint Presentation, pp. 1-35.


Figure 1: Line corrosion and scratches in Cu CMP.