µ-Scale Phenomen During CMP

µ-Scale Phenomen During CMP

Material Name: No data
Record No.: 46
Primary Chemical Element in Material: No data
Sample Type: Wafer
Uses: Polishing
Etchant Name: None
Etching Method: Polishing
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: A novel polymer-core silica-shell composites were proposed by Armini et al.. Polymethyl methacrylate (PMMA)-based terpolymer particles (diameter 350 nm) were coated with colloidal silica particles. The coating was performed either by creating chemical bonds using a silane coupling agent (composite A) or by adjusting the pH to form electrostatic attractive interactions between the core and the shell (composite B). They focused on tuning the mechanical properties of the polymer core by varying its synthesis parameters. The major advantage of the silica coating is that it can be easily modified in terms of its surface chemistry and morphology. Also, composite particles are aimed at improving the CMP process of soft materials due to the cushion-like effect arising from the elastic properties of the core, which allow the composites to easily adapt to the pad asperities (Fig. 1).
Reference: Tae-Young KWON, Manivannan RAMACHANDRAN, Jin-Goo PARK, Scratch formation and its mechanism in chemical mechanical planarization (CMP), Friction 1(4): 279–305 (2013).

Figure 1: Schematic diagram depicting µ-scale phenomena occurring during CMP. SEM images of (a) composite A and (b) composite B abrasives.