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Plastic and Brittle Fracture Scratches

Material Name: No data
Record No.: 50
Primary Chemical Element in Material: No data
Sample Type: Wafer
Uses: Polishing
Etchant Name: None
Etching Method: Polishing
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: Ring et al. reviewed the mechanical properties and fracture mechanics of materials in order to understand the surface damage caused during CMP. The resulting failure was predicted by various mechanical wear (or scratching) equations depending upon the assumption of plastic deformation or brittle fracture (Fig. 1). The wear rate goes from reasonably low rates for plastic wear to rates with higher orders of magnitude for brittle fracture.
Reference: Tae-Young KWON, Manivannan RAMACHANDRAN, Jin-Goo PARK, Scratch formation and its mechanism in chemical mechanical planarization (CMP), Friction 1(4): 279–305 (2013).


Figure 1: Schematic of (a) plastic deformation and (b) brittle fracture.