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PVD Coating Peeling

Material Name: Silicon
Record No.: 61
Primary Chemical Element in Material: Si
Sample Type: Wafer
Uses: Coating
Etchant Name: None
Etching Method: Coating
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: An issue with PVD coatings is achieving crack free coatings on large parts. Typically in E beam processing the part temperature has to be elevated and the part subject to RF ion cleaning prior to deposition. The temperature uniformity and efficiency of cleaning determine the cracking tendency and adhesion of the coating. Smaller parts with simple geometries as better suited to PVD applications.
Reference: Rajan Bamola, Paul Robinson, Alternative Methods of Yttria Deposition For Semiconductor Applications, Surface Modification Systems Inc. ITSC Houston 2012, PowerPoint Presentation, pp. 1-20.


Figure 1: PVD coating peeling.