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Killer Defect from Aluminum Etch Proces

Material Name: Aluminium
Record No.: 62
Primary Chemical Element in Material: Al
Sample Type: Layer
Uses: Coating
Etchant Name: None
Etching Method: Coating
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: An issue with PVD coatings is achieving crack free coatings on large parts. Typically in E beam processing the part temperature has to be elevated and the part subject to RF ion cleaning prior to deposition. The temperature uniformity and efficiency of cleaning determine the cracking tendency and adhesion of the coating. Smaller parts with simple geometries as better suited to PVD applications.
Reference: “A systematic Study and characterization of advanced Corrosion Resistance Materials and their Applications for Plasma Etching Processes in Semiconductor Wafer Fabrication”, Hong Shih, Etch Products Group, Lam Research Corporation, Fremont, CA www.intechopen.com/download/pdf/34479.


Figure 1: Killer defect from aluminum etch process.