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Scratches By Machine

Material Name: Wafer
Record No.: 69
Primary Chemical Element in Material: No data
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: Etching
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: No data
Reference: Website https://www.microtronic.com/defect-library/scratches-by-machine/, Image and text by courtesy of Microtronic company, 2020.


Figure 1: Here is an example of a scratch on a 200mm semiconductor wafer that was made by a machine as opposed to a person. Scratch macro defects appear as a straight line or curve that was made by a machine or robot handler.


Figure 2: EAGLEview found this scratch which was made by a robot wafer handler. In this wafer image, EAGLEview makes it very clear where the scratch is and you can see the scratch curving across the semiconductor wafer.