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Rework – Scrap Avoidance

Material Name: Wafer
Record No.: 72
Primary Chemical Element in Material: No data
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: Etching
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: No data
Reference: Website https://www.microtronic.com/defect-library/rework-scrap-avoidance/, Image and text by courtesy of Microtronic company, 2020.


Figure 1: EAGLEview can identify semiconductor wafers that require rework to enhance your scrap avoidance. Above is an example of a wafer that was reworked after being classified by EAGLEview.


Figure 2: Another example of a semiconductor wafer that was identified by EAGLEview as needing to be reworked.