Flashfield Defects

Flashfield Defects

Material Name: Wafer
Record No.: 81
Primary Chemical Element in Material: No data
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: Etching
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: No data
Reference: Website https://www.microtronic.com/defect-library/flashfield-defects/, Image and text by courtesy of Microtronic company, 2020.

Figure 1: Flash field defects are typically near the edge of the semiconductor wafer and due to a focus isssue for a stepper shot or possibly a topography issue.

Figure 2: Some flash field macro defects may occur in the interior of the wafer – these macro defects are also referred to as a dropped or missing shot.

Figure 3: Additional example of a flash field defect on the semiconductor wafer.

Figure 4: Additional example of a flash field macro defect on the semiconductor wafer.