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EBR Drip Defect

Material Name: Wafer
Record No.: 84
Primary Chemical Element in Material: No data
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: Etching
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: No data
Reference: Website https://www.microtronic.com/defect-library/ebr-drip-defect/, Image and text by courtesy of Microtronic company, 2020.


Figure 1: EBR drip, sometimes called the “eyelash” semiconductor wafer macro defect, may occur at a very low frequency possibly effecting a single semiconductor wafer in a lot at a rate of just 1-2 lots per day.