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CMP – Macro Defects

Material Name: Wafer
Record No.: 87
Primary Chemical Element in Material: No data
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Etching Method: Etching
Etchant (Electrolyte) Composition: No data
Procedure (Condition): No data
Note: No data
Reference: Website https://www.microtronic.com/defect-library/cmp-macro-defects/, Image and text by courtesy of Microtronic company, 2020.


Figure 1: There are a variety of CMP semiconductor wafer defects that are detected by Microtronic’s EAGLEview including residual defects, scratches, unpolished or insufficiciently polished semiductor wafers.