Optimization of the Etching Parameters of the Ion Milling System Nordiko 3600

Optimization of the Etching Parameters of the Ion Milling System Nordiko 3600

Material Name: See the Figure 1
Recipe No.: 10303
Primary Chemical Element in Material: See the Figure 1.
Sample Type: Single crystal
Uses: Etching
Etchant Name: None
Etching Method: Dry etching
Etchant (Electrolyte) Composition: See the data file.
Procedure (Condition): No data
Note: During this thesis were performed six runs. Unfortunately, two of them couldn’t be carried out until the end. In run #1, after performing the first etch the 6-inch wafer showed signs of corrosion, and the film seemed to start pilling off, that’s why that run was terminated. This was an important drawback; since junctions take time to be deposited, plus the machines not always are available to deposit junctions since other works are been carried out at same time. In the run #5 the junction’s magnetic properties were not right. There was problem with one of the targets during the deposition. The results obtained are mostly from the run #2 and #4. The 6-inch junction TJ1268 was processed in the run #2 and the samples N2TJ68 were processed in the run #4.
Reference: André Filipe Rodrigues Augusto, Optimization of the etching parameters of the ion milling system Nordiko 3600, PhD Thesis, Instituto Superior Technico, Universidade Technico de Lisboa, 2007, pp. 12, 53-69.

Figure 1: Layers from samples N2TJ68 (left) and TJ1268 (right). All samples N2TJ68 (A,B,C,D) were deposited at same time at sputtering deposition machine, Nordiko2000, while the 6-inch sample TJ1268 was deposited at ion beam deposition machine, Nordiko3000, both at INESC-MN.