Deposition

Deposition

10 Ti/90 W Ion-Milled
80 Ni/20 Cr Evaporated
ALD Etch-Back Method - TiO2
Action Marker Resist Pen
Al + 2% Si Sputtered Thin Film
Al2O3 Deposition - Vacuum deposition
Al2O3, TiO2 - Atomic Layer deposition (ALD) and Dry Etching
AlN Deposition - Vacuum deposition
Aluminum Evaporated
Aluminum Oxide Evaporated
Aluminum Oxide Ion-Milled
Ann. LTO LPCVD Calogic
Ann. LTO LPCVD Tylan
Ann. PSG LPCVD Tylan
Atomic Layer Deposition (ALD) - Deposition
Chromium Evaporated
Chromium Ion Milled
Classification of Thin Film and Ultra Thin Film Deposition Metods
Common Deposition Methods for Thin Films in Integrated Circuit Fabrication
Comparison of Gold Electrolytes Suitable for Microfabrication
Copper Evaporated
Deposition Conditions and Film Properties for Poly-SiC Films Deposited by APCVD
Deposition Conditions and Material Properties of Micro and Nanocrystalline Diamond Deposited by MPCVD
Deposition Conditions and Material Properties of Si Films Deposited by Sputtering
Deposition Conditions and Mechanical Properties for Epi-Poly Films
Deposition Conditions and Mechanical Properties of GaN Films
Deposition Conditions and Mechanical Properties of SiO2 Films Deposited by PECVD
Deposition Conditions and Properties of Polycrystalline Diamond Deposited by HFCVD
Deposition Conditions and Properties of Ultrananocrystalline Diamond (UNCD) by MPCVD
Deposition Conditions for Dichlorosilane-Based LPCVD Poly-SiC Processes
Deposition Conditions for LPCVD SiGe Films on Oxide Coated Si Substrates
Deposition Conditions for LTO and PSG Films Deposited in the MFL at CWRU
Deposition Conditions for Non-Dichlorosilane-Based LPCVD Poly-SiC Processes
Deposition Conditions for Stoichiometric and Low-Stress Nitride Films Deposited at CWRU
Deposition Conditions for Undoped LPCVD Polysilicon Films
Deposition Conditions for in Situ Doped LPCVD Polysilicon Films
Deposition Methods and Parameters for PZT Thin Films
Deposition Parameters Used to Deposit ZrN-Si Films via DC Reactive Magnetron Sputtering
Deposition Parameters and Insulating Properties for Si Films Deposited by PECVD
Deposition Parameters and Material Properties for As-Deposited LTO Films
Deposition Parameters and Material Properties for As-Deposited PSG Films
Deposition Parameters for Different Nanocomposite Films Obtained by Reactive Magnetron Sputtering
Deposition Parameters for Silicon Germanium Films Deposited by PECVD
Deposition Parameters for Silicon Nitride Films Deposited by PECVD
Deposition Parameters for Silicon Nitride and Silicon Dioxide - Dry Etching
Deposition Techniques Used for Depositing Nanocomposites Thin Films
Diamond - Deposition
Dry Etching Parameters for Silicon Nitride and Silicon Dioxide - Dry Etching
Electron Beam Evaporation - Deposition
Example Baths for Electroless Copper Deposition Using Formaldehyde Reducing Agent and Hypophosphite Reducing Agent
Example Baths for Electroless Nickel Deposition Using Various Hypophosphite Reducing Agents
Example Nickel Sulfamate Electrolytes Used for Microfabrication
Futurrex Negative Photoresist
Futurrex Positive Photoresist
Gold Evaporated
Groove for Inverted Rib Waveguide Patterning - Siliconoxynitride - Dry Etching
HfO2 Deposition - Vacuum deposition
IC and MEMS/NEMS Materials, Deposition Method, and Typical Application
LPCVD Polysilicon Deposition Recipes
Moly Evaporated
Negative Resist - Contact Alignment
Negative Resist - Suss Alignment
Nickel Evaporated
Niobium Ion Milled
OCG Positive 820 Photoresist
Overview of Sulfite-Based Electrolytes: Composition, Process Parameters, and Applications
Oxide Ion-Milled
Oxide PECVD Annealed
Oxide PECVD Unannealed
PECVD Process Parameters - Deposition
PECVD Silicon Nit. High RI
PECVD Silicon Nit. Low RI
Palladium Evaporated
Parameters Used in the Deposition of ZnO:Al Thin Films Using Oxygen in the Chamber
Parameters Used in the Deposition of ZnO:Al Thin Films at 200 C and 250 C and Without Oxygen
Parameters Used in the Deposition of ZnO:Al Thin Films with Substrate Heating and DC Biasing
Parameters Used in the Deposition of ZnO:Al Thin Films with the Mixture of Hydrogen and Argon
Parylene Type C
Patterned Cr on Au Evaporated
Physical Vapor Deposition (PVD) - Deposition
Plasma-Enhanced Chemical Vapor Deposition Parameters for Silicon Dioxide and Silicon Nitride Thin Films Deposited Using a Plasma-Therm 790
Platinum Evaporated
Poly SiGe LPCVD p-Type
Polymer Deposition Rate as Function of the rf Power - Deposition
Positive Resist - Contact Alignment
Positive Resist - Suss Alignment
Properties of Annealed PSG and LTO Films
Pt Deposition - Vacuum Deposition
Reactive Ion Etching (RIE) Parameters for SiO2 Etching
Ru Deposition - Vacuum deposition
S1822 Positive Photoresist
Sapphire Wafer
Select Examples of Hard Magnetic Films
Si-Rich Si Nit. LPCVD
SiNx - Deposition
SiO2 - Deposition
SiO2 Deposition - Vacuum deposition
SiO2 Layer Deposition by Plasma-Enhanced Chemical Vapour Deposition (PECVD)
Silicon Nitride Deposition Recipe - Deposition
Silicon Wafer - Hard Mask Deposition
Siliconoxynitride Layer Deposition Condition
Siliconoxynitride Layer Etching Condition - Dry Etching
Silver Evaporated
Some Material Properties for Select Polymers
Some Sulfate and Sulfate-Chloride Based Ni?Fe Electrolytes for Microfabrication
Spin-On PI 2556 Polyimide
Sputter Deposition - Deposition
Sputter Deposition - Film Profiles - Deposition
Sputter Deposition Parameters for Piezoelectric AlN and ZnO Thin Films
Stoich. Si Nit. LPCVD
Ta2O5 - Deposition
Tantalum Evaporated
Tantalum Ion-Milled
Thermal Oxide Wet-Grown
TiN Deposition - Vacuum deposition
TiN Sputtered
TiO2 Deposition - Vacuum deposition
Titanium Sputtered
Tungsten Sputtered
Typical Electroless Plating Baths
Unan. LTO LPCVD Tylan
Unan. PSG LPCVD Tylan
Vanadium Sputtered
Various Processes for Multilayer Conductor Layers with Vias
ZnO - Sputtering
ZnO Deposition - Vacuum deposition
ZnO:Al Deposition - Vacuum deposition
ZrO2 Deposition - Vacuum deposition
p-type GaAs(100) - Dry Thin Films Deposition