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Copper (pure) - Dislocation etching

Material Name: Copper (pure)
Recipe No.: 10147
Primary Chemical Element in Material: Cu
Sample Type: Bulk
Uses: Etching
Etchant Name: None
Type (Macro/Micro): Micro
Etching Method: Dislocation etching
Etchant (Electrolyte) Composition: 20 ml sta. FeCl3 solution, 20 ml HCl, 5 ml acetic acid, 5-10 drops Br2.
Note: (111)
Procedure (Condition):  Etch 15-30 s, rinse in NH4OH, then with water. Lovell and Wernick.
Reference: Vander Voort, Metallography Principles and Practice, McGraw-Hill, Inc., 1984, p. 717.