Nitride Etchants

Nitride Etchants

(Al,Ti)N, AlN-Y2O3, TiN - Chemical etching
(RE)N12 specimens - Chemical etching
ASTM etchant No. 119 - Mg-Mn alloys - Chemical etching
ASTM etchant No. 161 - TaN thin films - Chemical etching
Agua Regia - Si3N4, oxynitrides, SiO2 as thin films or glass and quartzware - Chemical cleaning
Al and Ti nitride - Chemical etching
Al, and A12O3/A1N thin films - Gas etching
Al2O3 substrate blanks - Gas cleaning
AlN specimens - Chemical etching
AlN thin films (100) and (111)-Acid, float-off
AlN-La2O3 - Chemical ecthing
Alloy steel specimens - Color etching - Colors pearlite and hardened structures of unlloyed steel specimens
Alloy steels - Color etchant
Alloy steels - Color etching - For carbon, alloy and Fe-Mn (5-18% Mn) steels
Alumina-silical-lime-nitride glasses - 20.2-25.3% Si, 8.3-14.3% Al, 3.4-4.3% Cu, 43.5-60.6% O, 2.2-16.8% N
Aluminium nitride (AlN) - AlN with La2O3
Aluminium nitride (AlN) - AlN with Y2O3
Aluminium nitride (AlN) - Chemical etching
Aluminium nitride (AlN) - Chemical etching
Aluminium nitride (AlN)
Aluminium nitride AlN - Etching
Au/TiW thin - Films on Al film deposited on (111) silicon wafers-xgas, blister forming
Austenitic stainless steels - Color etching
B as boron nitride test blanks - Metal, removal/preferential
BHF etchant - NxSiO2 thin films - Chemical etching
BHF etchant - Si3N4 thin filmorphous deposits - Chemical etching
BHF etchant - Si3N4 thin films RF plasma grown on silicon - Chemical etching
BHF etchant - Si3N4 thin films deposited on (100) silicon wafers - Chemical cleaning
BHF etchant, modified - Si3N4 and Si3NxOy thin films - Chemical etching
BHF etchant, modified - Si3N4 thin films - Chemical etching
BN (100) cubic boron nitride - Metal, removal
BN as pressed powder test blanks - Chemical etching
Beraha's etchant - Iron, steels, cast irons - Tint etchant for pure iron and carbon steels, cast iron, and alloyed steels
Beraha's tint etchant - Co-based alloys - Tint etching
Beraha's tint etchant - For pearlitic steels and and cast irons - Chemical etching
Beraha's tint etchant - For stainless steels
Beraha`s tint etchant - For Fe, Ni, or Co base heat resistant alloys
Beta-Si3N4 - Chemical etching
Boron nitride (BN) - Chemical etching
Boron nitride (BN) - Chemical etching
Ca pure metal specimens - Oxidation
Ca2N3 thin films - Chemical etching
Carbon steels - Color etching
Carbon steels, tool steels - Color etching
Carbon, alloy and Fe-Mn (5-18% Mn) steels - Color etching
Cast irons - Color etching
Cast irons - Color etching
Ceramics, nitrides - (Al, Ti)N
Ceramics, nitrides - NbN (yelow), Nb2N (light red)
Ceramics, nitrides - Si3N4
Ceramics, nitrides - Si3N4
Ceramics, nitrides - Si3N4
Ceramics, nitrides - Si3N4, UN
Ceramics, nitrides - UN
Ceramics, nitrides - UN
Ceramics, nitrides - UN
Ceramics, nitrides - UN
Ceramics, nitrides - UN, UN-U2N mixtures
Ceramics, nitrides - UN-U(N2O)-U2N3 mixtures
Ceramics, nitrides - UN-U2N3 mixtures
Cerium oxide-silicon nitride system - (1Si3N41CeO2)
Chrome regia etchant - Si3N4 oxynitrides and SiO2 thin films - Chemical cleaning
EDP etchant for single crystal silicon - Chemical etching
GaAs (100) Si-doped wafers - Chemical cleaning
GaAs (100) wafers - Chemical etching
GaAs (100) wafers - Chemical etching
GaAs (100), n-type wafers - Chemical etching
GaN (0001) single crystal thin films - Electrolytic etching
GaN thin films - Chemical etching
Gallium nitride (GaN) - Electrolytic etching
GdN12 specimens - Chemical etching
Ge2O3, DC sputtered thin films - Chemical etching
Ge3N4 and Ge3O(1-x)N(x) - Chemical etching
Ge3N4 and Ge3OxNy thin films - Chemical etching
Ge3N4 thin films-Gas densification
Gray cast irons - Color etchant
Groesbeck etchant - Alloys with Cr and or Co
Heat-resisting steels and alloys - Color etching
Heat-resisting steels and alloys - Color etching
Heat-resisting steels and alloys - Color etching
HfN thin film - Chemical cleaning
High carbon steels - Color etchant
InP p-type single crystal wafers - Chemical polishing
Iron and steels - Chemical etching
Iron, steels, cast irons - Carbides, nitrides, phosphides, and sulfides are not attacked
LiN thin films - Chemical etching
Lithium nitride-Li3N - Chemical thinning
Low carbon steels - Color etchant- General microstructure
Meyer and Eichholz's No. 2 etchant - For etching nitrided layer in steel
Meyer and Eichholz's No. 2 etchant - Nitrided DIN 1.8550(34CrAlNi7) steel specimens - Macro etching for segregation
Mg3N4 thin films deposited on Mg specimen blanks - Chemical etching
MoN and Mo2N thin films grown on (100) silicon wafers - Chemical etching
Murakami's etchant - W-Hf-N alloys alloy - < 3% Hf, nitrided
Murakami's etchant - W-Hf-Re-N alloys alloy - < 2% Hf, < 25% Re, nitrided
Murakami's etchant - W-Mo-Hf-Re-N alloy - < 20% Mo, < 2% Hf, < 30% Re, nitrided
Murakami's etchant - Wrought Fe-Ni-Cr heat resisting alloys - Inconel 706 and alloy 718, carbide particles
Murakami's etchant, boiling - Aluminium nitride (AlN) - Chemical etching
Murakami's etchant, modified - AlN-Al2O3 - Chemical etching
Murakami's etchant, modified - Aluminium nitride (AlN) - AlN with Al2O3
Murkami's etchant - Steel specimens - Carbide etching
Nb-N system - Electrolytic etching
NbN (100) thin films deposited on NaCl - Ionized gas cleaning
NbN (yellow), Nb2N (pink) - Electrolytic etching
Nitrided steels - General macrostructure
Poly-Ta rod, sheet, wire - Chemical cleaning
Pure iron, nitrided with less than 0.015% C - Electrolytic polishing
Pure iron, nitrided with less than 0.015% C - Electrolytic polishing
Pure iron, nitrided with less than 0.015% C - Electrolytic polishing
Samarium-terbium orthoferrite (Sm0.35 x Tb0.43 x FeO3) - Chemical polishing
Si (100) wafers used as substrates in a study of oxide and nitride - Chemical etching
Si (100), n-type, 5-9 Ohm cm resistivity wafers - Chemical cleaning
Si (111) and (110) wafers - Chemical etching
Si (111), (100) wafers as substrates for deposition of Si3N4 - Chemical etching
Si and SiO(x)N(y) DC sputtered thin films on (111) silicon wafers - Chemical etching
Si3N4 - Chemical etching
Si3N4 - Chemical etching
Si3N4 - Chemical etching
Si3N4 - Chemical etching
Si3N4 - Chemical etching
Si3N4 - Chemical etching
Si3N4 - Chemical etching
Si3N4 - Chemical etching
Si3N4 - Physical etching
Si3N4 - Thermal etching
Si3N4orphous thin films - Chemical ecthing
Si3N4 and oxynitride thin films - Chemical cleaning
Si3N4 and oxynitride thin films on silicon - Chemical etching
Si3N4 and oxynitride thin films on silicon - Chemical etching
Si3N4 and oxynitrides as DC sputtered thin film deposits on (111) silicon, n-type, 5-10 Ohm cm resistivity wafers - Chemical etching
Si3N4 and oxynitrides deposits on (111) silicon - Chemical etching
Si3N4 and oxynitrides grown as thin films by DC sputtering on (111) silicon wafers - Chemical etching
Si3N4 oxynitrides and SiO2 DC/RF sputtered thin films - Chemical cleaning
Si3N4 pressed powder blanks - Polishing
Si3N4 thin filmorphous deposits on silicon wafer substrates - Chemical etching
Si3N4 thin films - Chemical cleaning
Si3N4 thin films deposited on silicon substrates - Chemical etching
Si3N4, SiO2 and glass - Chemical cleaning - Glass cleaner etchant
Si3N4, UN - Physical etching
Si3N4, oxynitrides and SiO2 thin films - Chemical cleaning
SiN(x) and SiO2 thin films - Chemical ecthing
SiO2 and Si3N4 thin films deposited on silicon - Chemical etching
SiO2 single crystal blanks - Chemical cleaning
SiO2 thin film coatings - Oxide, growth
SiO2 thin film oxidation of silicon, (111) n-type wafers - Chemical etching
SiO2 thin films 160 nm thick - Chemical etching
SiO2 thin films deposited on (1OO) silicon wafers - Chemical etching
Silicon nitride (Si3N4) - Chemical etching
Silicon nitride (Si3N4) - Chemical etching
Silicon nitride (Si3N4) - Chemical etching
Silicon nitride (Si3N4) - Chemical etching
Silicon nitride (Si3N4) - Chemical etching
Silicon nitride (Si3N4) - Physical etching
Silicon nitride (Si3N4) - Physical etching
Silicon nitride (SiN) - Chemical and physical etching
Silicon nitride (SiN) - Chemical etching
Silicon nitride (SiN) - Chemical etching
Silicon nitride (SiN) - Chemical etching
Silicon nitride (SiN) - Ion beam machinning
Silicon nitride Si3N4 - Etching
Silicon nitride-alumina-silica system - (Si12Al18N8(2Si3N4 x 9Al2O3 x 6SiO2))
Steel specimens - Carbide etching
Ta (100) wafers - Chemical etching
Ta oxides, nitrides and carbides - Chemical etching
Ta thin films converted to Ta2O5 and TaN - Chemical etching
TaN - Chemical etching
TaN thin film deposits - Chemical polishing
TaN thin films - Chemical etching
TaN thin films - Chemical etching
Tantalum nitrides (Ta8N, Ta38N5) - Electrolytic thinning
Thulium orthoferrite (TmFeO3) - Chemical polishing
TiN thin films deposited on silicon wafers - Chemical etching
Titanium nitride (TiN)-Molybdenum cermets (MoO3) - Chemical etching
Tool steels - Color etching - Colors pearlite and hardened structures of unlloyed steels
Tool steels - Color etching - For carbon, alloy and Fe-Mn (5-18% Mn) steels
UC (001) wafers - Electrolytic jet thinning
Uranium nitride (UN) - Chemical etching
Uranium nitride (UN) - Chemical etching
Uranium nitride (UN) - Electrolytic polishing
Weck's etchant - Pure Ti and Ti alloys - Chemical etching
White cast irons - Color etchant
Zirconium nitride (ZrN) - ZrN-ZrN(0.55)
Zr alloys with intermetallic phases, oxides, nitrides and hydrides - Anodizing
ZrN (100) wafers - Thermal cleaning
ZrN - Chemical etching
i-C-Gas, growth