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CaCO3 r(1011) cleaved wafers - Dislocation etching

Material Name: CaCO3 r(1011) cleaved wafers
Recipe No.: 6029
Primary Chemical Element in Material: Ca
Sample Type: Wafer
Uses: Etching
Etchant Name: None
Type (Macro/Micro): Micro
Etching Method: Wet (dislocation) etching
Etchant (Electrolyte) Composition: 1 part CH3CH2COOH, 1 part H2O.
Procedure (Condition): Time: 120 sec, temperature: RT.
Note: CaCO3 r(1011) cleaved wafers.
Reference: Perrin Walker, William H Tarn: Handbook of metal Etchants, CRC Press, Boca Raton, USA, 1990.