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CaWO4 (001) wafers - Chemical etching

Material Name: CaWO4 (001) wafers
Recipe No.: 6046
Primary Chemical Element in Material: Ca
Sample Type: Wafer
Uses: Etching
Etchant Name: Agua regia
Type (Macro/Micro): Micro
Etching Method: Wet (chemical) etching
Etchant (Electrolyte) Composition: 3 parts HCl, 1 part HNO3 (Agua regia).
Procedure (Condition): Temperature: RT.
Note: CaW04 (001) wafers used in a study of deformation and slip. Solution used to develop slip patterns and dislocation etch pits.
CaWO4 (001) wafers. ingots were grown with (100) orientation, and and cut (001) basal as free of low-angle grain boundaries. After mechanical lap, solution used to etch polish and develop dislocation distributions.
Reference: Lockayne, B - Br J Appl Phys. 16,423(1965).