Semiconductor Defects - Figure Browser

Semiconductor Defects - Figure Browser

µ-Scale Phenomen During CMP

2 Chamber Macro Defect

3 Chamber Macro Defect

75% Over Etch - GaN

Aluminum Corrosion - Dry etching

Amorphous Silicon Spikes

Arcing Defects

Arcing Generated Aluminum Particle on Wafer Surface

Au Shorting Two Wires

Backside Contamination

Bevel Etch

Bias Voltage Variation - GaN

Blocked Etch Macro Defect

Bowing

Breakdown in Vertical Gate Oxide

CMP – Macro Defects

CMP-Induced Defects

Carbon Contamination

Categories of Different Types of Scratches

Cavity Defects, Columnar Defects - GaN

Center Spin Macro Defect

Charge Losses for VB Grown CdMnTe Detector

Chatter Surface Damage

Contaminants Over the Substrate Surface

Cooper Voids, Silicon Micrograss

Corner Cavity in Collector Mesa

Corrosion of Au Plated Connector

Cr/Au film Peeling

Crack in Aramid Fiber/Epoxy Matrix Interface

Crystalline Defects in Silicon

Damaged Layer

Defect in Digital Micromirror Device

Defects in Transistors Revealed by Etching

Degradation Caused by Excessive Cycle Times During Bosch Process

Delamination, Adhesive Squeeze Out, Blisters, Crack at Edge Zone, Crack, Wafer Shift

Developer Related Defects

Dishing and Erosion

Dislocations

Distorted Oxide Hard Mask Patterns

Dual Damascene Structure - Copper Wafer

EBR Drip Defect

Edge Chips – Macro Defects

Etch Pattern of Swirl Defects in Silicon

Etch Pits Revealed in CdZnTe THM-Grown Sample

Etch induced damage for different processes - HgCdTe

Evidence of Charge Losses by Star-Shaped Features - CdZnTe

Example of Notching and Bowing Occuring in an Etched Sample

Example of an Unsuccessful Cr Lift Off

Examples of Defect Adders Within the Oxide-Masked Al Etching Process Sequence

Faceting

Faceting/Trenching/Sidewall Taper

Failure Modes IKnduced by Tin Whiskers

FexOy Particles

First 12 Wafers – Different

Flashfield Defects

Fluorine Contamination

Footing Effect

Gate Conductor (GC) Short

Gate Oxide Defects

Grass

Grown-in Dislocations and Sub-grain Boundaries - CdZnTe

H2 Bubbles

High-Density Dislocation Pits in VB Grown CdMnTe Crystal

Hollows, Hillocks - Copper Wafer

Humans as Source of Particles I

Humans as Source of Particles II

Humans as Source of Particles III

Humans as Source of Particles IV

Humans as Source of Particles V

Humans as Source of Particles VI

Image Bilayer

Image Bilayer

InGaAs Nano-HEMT's Metal Filling Issue

Inclusions with Voids - CdZnTe

Irregular Wet Etching of Cr Mask

Killer Defect from Aluminum Etch Proces

Killer Defects Generated in Aluminum Metal Etch Processes

Kirkendall’s Voids

Lens Stepper Macro Defects

Line Corrosion and Scratches

Loading Examples

Low Sample Temperature

Macro-Bubbles and Fiber-Like Inclusions in YCa4O(BO3)3 (YCOB) Crystals

Metal Residue Between BL and VSS-Line I

Metal Residue Between BL and VSS-Line II

Metal Residue Between BL and VSS-Line III

Metal Residue Between BL and VSS-Line IV

Micro-Masking/Roughness - GaN

Microscope Image of the Surface of Polyimide PI 2611 After Coating

Microtrenching

Misaligned Ball

Misalignment

Missing Metal Pillars

Missing Patterns

Molten Polysilicon Filaments

Molten Silicon/Aluminum Filament

Necking

Normal and Bad Etch Results

Open Metal Line

Over Etch - GaN

Over Etch - GaN

Overetched Mo with H2SO4 HNO3 H2O, 532 Ratio

Overetching of Polyimide Film

Overlay Shift

Oxygen Flow Variation - GaN

PVD Coating Peeling

Partial Pattern – No Expose

Particle Defect

Particle Defects

Particles on Chips A Metal Ball

Particles on Chips Blood Cells

Particles on Chips Hair I

Particles on Chips Hair II

Particles on Chips Spider Silk

Particles on Chips Unknown Object

Pattern Shifting - SoC

Photoresist Under-Exposure

Pinholes Developed in the SiO2

Plasma Surface Roughness - GaN

Plastic and Brittle Fracture Scratches

Poly Haze Macro Defect

Poly Short Line

Poly Short Line

Poor Rinse – Macro Defect

Poor Salicide Coverage

Post Metal Etch Residue - Al Layer

Potential Causes of CMP Defects and possible Solutions

Previous Layer Defects

Process Defect

Process Induced Defects in Silicon Wafers

Process Induced Defects Haze

Process Induced Defects Stacking Faults

Pyrex Glass Wafer - Defects Observed on the Etched Glass Surface

RIE Lag

Residue

Residue Clinging to Wire Edges

Residue Left from RIE/ICP Etching PI 2611 in O2/CF4

Residue on the Polyimide PI 2611

Resist Mask Wear Out

Reticle Tilt Defect

Rework – Scrap Avoidance

Rework – Yield Improvement

Scalloping - Silicon - Dry etching

Scalloping Effect - Silicon

Scratch Level on STI Patterned Wafers

Scratch Through a Polyimide PI 2562 and Cr/Au Film

Scratches By Human

Scratches By Machine

Scratches Formed on STI-Patterned Wafers

Shallow Etch Pits

Shallow Grinding Lines

Shorted Bumps

Si Recess Etching Dry Etch

Sidewall Damage - Silicon - Dry Etching

Silicon Defect with Very Gross Electrical Leakage

Size and Density of Star-Shaped Features and Their Effect - CdZnTe

Slanting Edges of Etched Oxide

Solder Cracks

Solder-Bump Short

Solder/Pad Interface Crack

Spin Defect on Edge

Spin Defect – Entire Wafer

Spin Defect – Line

Striations

Sub Surface Cu Voids

Sub-Surface Damage

Subsurface Damage Caused by Coarse Grinding

TMDE - Time Multiplexed Deep Etching

The Air We Breath

TiN-Rich Metal Flake Between BL and VSS-Line

Tin Electrochemical Migration

Topographic image of Etched Surface Obtained by Optical Profilometer - CdZnTe

Tornado Shape After Poly-Si Wet Etching

Tungsten (W) Plugs

Tungsten Stringer Between Center Contacts

Tweezer Marks

Underdeveloped Photoresist

Unfilled Contact

Uniform Etching of PI 2562

Voids - Germanium

Voids in Solder Ball

Wafer Contamination – Large

Wafer Contamination – Small

Wafer Edge Discoloration

Wafer Hotspot Defects

Wafer Spinning Rate

Water Condensation

XRT and IR Images of Defects in CdZnTe Crystals