Semiconductor Defects

Semiconductor Defects

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µ-Scale Phenomen During CMP 2 Chamber Macro Defect
3 Chamber Macro Defect
75% Over Etch - GaN
Aluminum Corrosion - Dry etching
Amorphous Silicon Spikes
Arcing Defects
Arcing Generated Aluminum Particle on Wafer Surface
Au Shorting Two Wires
Backside Contamination
Bevel Etch
Bias Voltage Variation - GaN
Blocked Etch Macro Defect
Bowing
Breakdown in Vertical Gate Oxide
CMP – Macro Defects
CMP-Induced Defects
Carbon Contamination
Categories of Different Types of Scratches
Cavity Defects, Columnar Defects - GaN
Center Spin Macro Defect
Charge Losses for VB Grown CdMnTe Detector
Chatter Surface Damage
Contaminants Over the Substrate Surface
Cooper Voids, Silicon Micrograss
Corner Cavity in Collector Mesa
Corrosion of Au Plated Connector
Cr/Au film Peeling
Crack in Aramid Fiber/Epoxy Matrix Interface
Crystalline Defects in Silicon
Damaged Layer
Defect Etching in Silicon
Defect in Digital Micromirror Device
Defects in Transistors Revealed by Etching
Degradation Caused by Excessive Cycle Times During Bosch Process
Delamination, Adhesive Squeeze Out, Blisters, Crack at Edge Zone, Crack, Wafer Shift
Developer Related Defects
Dishing and Erosion
Dislocations
Distorted Oxide Hard Mask Patterns
Dual Damascene Structure - Copper Wafer
EBR Drip Defect
Edge Chips – Macro Defects
Etch Pattern of Swirl Defects in Silicon
Etch Pits Revealed in CdZnTe THM-Grown Sample
Etch induced damage for different processes - HgCdTe
Evidence of Charge Losses by Star-Shaped Features - CdZnTe
Example of Notching and Bowing Occuring in an Etched Sample
Example of an Unsuccessful Cr Lift Off
Examples of Defect Adders Within the Oxide-Masked Al Etching Process Sequence
Faceting
Faceting/Trenching/Sidewall Taper
Failure Modes IKnduced by Tin Whiskers
FexOy Particles
First 12 Wafers – Different
Flashfield Defects
Fluorine Contamination
Footing Effect
Gate Conductor (GC) Short
Gate Oxide Defects
Grass
Grown-in Dislocations and Sub-grain Boundaries - CdZnTe
H2 Bubbles
High-Density Dislocation Pits in VB Grown CdMnTe Crystal
Hollows, Hillocks - Copper Wafer
Humans as Source of Particles I
Humans as Source of Particles II
Humans as Source of Particles III
Humans as Source of Particles IV
Humans as Source of Particles V
Humans as Source of Particles VI
Image Bilayer
Image Bilayer
InGaAs Nano-HEMT's Metal Filling Issue
Inclusions with Voids - CdZnTe
Irregular Wet Etching of Cr Mask
Killer Defect from Aluminum Etch Proces
Killer Defects Generated in Aluminum Metal Etch Processes
Kirkendall’s Voids
Lens Stepper Macro Defects
Line Corrosion and Scratches
Loading Examples
Low Sample Temperature
Macro-Bubbles and Fiber-Like Inclusions in YCa4O(BO3)3 (YCOB) Crystals
Metal Residue Between BL and VSS-Line I
Metal Residue Between BL and VSS-Line II
Metal Residue Between BL and VSS-Line III
Metal Residue Between BL and VSS-Line IV
Micro-Masking/Roughness - GaN
Microscope Image of the Surface of Polyimide PI 2611 After Coating
Microtrenching
Misaligned Ball
Misalignment
Missing Metal Pillars
Missing Patterns
Molten Polysilicon Filaments
Molten Silicon/Aluminum Filament
Necking
Normal and Bad Etch Results
Open Metal Line
Over Etch - GaN
Over Etch - GaN
Overetched Mo with H2SO4 HNO3 H2O, 532 Ratio
Overetching of Polyimide Film
Overlay Shift
Oxygen Flow Variation - GaN
PVD Coating Peeling
Partial Pattern – No Expose
Particle Defect
Particle Defects
Particles on Chips A Metal Ball
Particles on Chips Blood Cells
Particles on Chips Hair I
Particles on Chips Hair II
Particles on Chips Spider Silk
Particles on Chips Unknown Object
Pattern Shifting - SoC
Photoresist Under-Exposure
Pinholes Developed in the SiO2
Plasma Surface Roughness - GaN
Plastic and Brittle Fracture Scratches
Poly Haze Macro Defect
Poly Short Line
Poly Short Line
Poor Rinse – Macro Defect
Poor Salicide Coverage
Post Metal Etch Residue - Al Layer
Potential Causes of CMP Defects and possible Solutions
Previous Layer Defects
Process Defect
Process Induced Defects in Silicon Wafers
Process Induced Defects Haze
Process Induced Defects Stacking Faults
Pyrex Glass Wafer - Defects Observed on the Etched Glass Surface
RIE Lag
Residue
Residue Clinging to Wire Edges
Residue Left from RIE/ICP Etching PI 2611 in O2/CF4
Residue on the Polyimide PI 2611
Resist Mask Wear Out
Reticle Tilt Defect
Rework – Scrap Avoidance
Rework – Yield Improvement
Scalloping - Silicon - Dry etching
Scalloping Effect - Silicon
Scratch Level on STI Patterned Wafers
Scratch Through a Polyimide PI 2562 and Cr/Au Film
Scratches By Human
Scratches By Machine
Scratches Formed on STI-Patterned Wafers
Shallow Etch Pits
Shallow Grinding Lines
Shorted Bumps
Si Recess Etching Dry Etch
Sidewall Damage - Silicon - Dry Etching
Silicon Defect with Very Gross Electrical Leakage
Size and Density of Star-Shaped Features and Their Effect - CdZnTe
Slanting Edges of Etched Oxide
Solder Cracks
Solder-Bump Short
Solder/Pad Interface Crack
Spin Defect on Edge
Spin Defect – Entire Wafer
Spin Defect – Line
Striations
Sub Surface Cu Voids
Sub-Surface Damage
Subsurface Damage Caused by Coarse Grinding
TMDE - Time Multiplexed Deep Etching
The Air We Breath
TiN-Rich Metal Flake Between BL and VSS-Line
Tin Electrochemical Migration
Topographic image of Etched Surface Obtained by Optical Profilometer - CdZnTe
Tornado Shape After Poly-Si Wet Etching
Tungsten (W) Plugs
Tungsten Stringer Between Center Contacts
Tweezer Marks
Underdeveloped Photoresist
Unfilled Contact
Uniform Etching of PI 2562
Voids - Germanium
Voids in Solder Ball
Wafer Contamination – Large
Wafer Contamination – Small
Wafer Edge Discoloration
Wafer Hotspot Defects
Wafer Spinning Rate
Water Condensation
XRT and IR Images of Defects in CdZnTe Crystals